Category: News

Epoxies, Etc. has developed a fast curing thin film Electrically Conductive Adhesive.  Room temperature curing Electrically Conductive Adhesives are ideal for bonding and sealing applications that cannot utilize heat to cure the adhesive.  However, the down side to many of these materials is the extended room temperature cure of one to three days.  40-3907 has a thin film set time of ninety minutes at room temperature and within six hours is close to full hardness (Shore D 78).

40-3907 may be used as a repair material for electrical traces providing better chemical resistance and adhesion than conductive inks.  Other common applications for 40-3907 include solder replacement, EMI\RFI shielding, grounding, die attach, SMD attach, and flip chip attachments.

Epoxies, Etc. has been formulating solutions for electronic circuitry and assemblies for over 25 years.  Our chemists and engineers are able to provide application support.

Four of Epoxies, Etc.’s UL Listed Potting and Encapsulating Compounds are high-lighted on epoxies.com  All  four of the products pass the stringent self-extinguishing UL 94 V-0 test and are listed with Underwriters Laboratory.  The products offer different properties and satisfy a large variety of potting and encapsulating requirements.  PDF links to the Technical Bulletins are available along with informative videos.

20-2362                UL Listed Urethane Potting Compound

50-2369                UL Listed Urethane Thermally Conductive Potting Compound

50-3150                UL Listed Epoxy Thermally Conductive Potting Compound

50-3152                UL Listed Epoxy Thermally Conductive Potting Compound

Samples are available and may be requested by visiting the following link:

Sample Request or email sales@epoxies.com

Mixing and proportioning of two component epoxy systems is time consuming and prone to processing errors.  The 20-3213 is a one component heat cure system designed for electronic applications requiring excellent dielectric properties.  No more weighing and mixing.

20-3213 is low in viscosity (3,000 cps) allowing for easy flow and quick processing. It can be used as an impregnating compound in electrical laminations, a potting compound, and an underfill encapsulant.  Once cured, the epoxy provides excellent moisture protection and electrical insulation properties.

A popular packaging option for the 20-3213 is pre-filled 10, 30, or 55cc syringes.  One and five gallon bulk packaging is also available.

Electronic assemblies and delicate components increasingly need soft encapsulating materials to provide protection.  A unique series of Clear Silicone Gels (20-1700 Series) were developed to seal and protect electronics from vibration, mechanical stress, and shock.  They are also used to isolate circuits from moisture and contaminants while providing electrical insulation.

The 20-1700 Potting and Encapsulating Silicone Gels consist of four different products.  Users can select the cure speed and firmness of the gel that best suits their application.  Due to their excellent electrical properties, dielectric strength, and resistivity, the 20-1700 Series are used to encapsulate electronic components, junction boxes, power modules and LED’s.  They are formulated without solvents or other toxic materials.

The popular TriggerBond® dual barrel cartridge system is the preferred packaging option for the 20-1700 Series due to the quick gel time of the Silicone Gels.  TriggerBond 50ml, 200ml, and 400ml cartridges are available.

High performance two component Potting and Encapsulating materials are known for their slow room temperature cure times. This becomes a frustrating productivity issue for many manufacturers.  Epoxies, Etc. has a solution.  A newly developed polyurethane cures within one hour at room temperature.  The 20-2183 is unique because it does not have a high exothermic temperature during cure like so many other fast curing epoxy resin systems.  In addition to its fast cure, other benefits of the 20-2183 include low stress imparted on electronic components during cure, excellent vibration resistance provides electronic components protection, and a tough elastomeric material helps assemblies withstand thermal cycling.

The easy 2:1 mix ratio and low viscosity makes the 20-2183 easy to use in cable assemblies, potting electronics, molding parts, or encapsulating electronic components.  Due to its moisture resistance it may be used in wet environments and outdoor applications.

The popular TriggerBond® dual barrel cartridge system is the preferred packaging option for the 20-2183. TriggerBond 50ml, 200ml, and 400ml cartridges are available.

A video has been created explaining the quality process behind the creation of the FreezeBond® premixed and frozen syringes.  A premixed and frozen epoxy adhesive eliminates waste, reduces worker exposure to chemicals, and improves quality.  With FreezeBond there is no more weighing or mixing of two component materials.  Epoxies, Etc. does all of the preparation in its quality controlled environment.  The two components of the epoxy or silicone system are premixed together in the correct ratio, all air is removed, the air free material is packaged in a ready to use syringe, and then frozen to stop the chemical reaction.  Watch the video to learn more about the FreezeBond premixed and frozen epoxy adhesives and potting compounds.