An Optical and Semiconductor Grade Epoxy Resin system has been developed for LED encapsulating, glob top encapsulation, fiber optics and as an underfill for flip chips. The 20-3401 provides outstanding adhesion to glass, quartz, most plastics, and metals. It is easy to work with, allows users a long working time, and easily flows at room temperature. REACH and RoHS compliant, this epoxy resin is a good choice for electronic assemblies. In addition, 20-3401 is available in the convenient FreezedBond® premixed and frozen syringes. Samples of the 20-3401 Clear Epoxy are available.