20-2121 is formulated for electronic potting, encapsulating and casting applications.This polyurethane resin system is a two component, low viscosity, low toxicity, room temperature curing system. 20-2121 was designed for specifically for potting and encapsulating sensitive electronic components. It will impart very little stress on components during and after cure.
The base Natural Oil Polyol (NOP) used in 20-2121 is obtained directly from a plant source without chemical modifications. Due to the raw materials selected, this product is low in toxicity and considered a GREEN Potting Compound.
Epoxies, Etc. has been formulating epoxy, urethane, and silicone solutions for electronic circuitry and assemblies for over 25 years. Samples are available and ship within three business days.