Meridian Adhesives Group - The Science of Solutions

One Component Epoxy Engineered For Electronic Applications

lack Potting PCBMixing and proportioning of two component epoxy systems is time consuming and prone to processing errors.  The 20-3213 is a one component heat cure system designed for electronic applications requiring excellent dielectric properties.  No more weighing and mixing.

20-3213 is low in viscosity (3,000 cps) allowing for easy flow and quick processing. It can be used as an impregnating compound in electrical laminations, a potting compound, and an underfill encapsulant.  Once cured, the epoxy provides excellent moisture protection and electrical insulation properties.

A popular packaging option for the 20-3213 is pre-filled 10, 30, or 55cc syringes.  One and five gallon bulk packaging is also available.