Meridian Adhesives Group - The Science of Solutions

Thermally Conductive Epoxy Adhesive

Triggerbond-50-3112GR50_5075_0x400Managing heat in electronic assemblies is a challenge for countless manufacturers. Many assemblies require the use of  thermally conductive adhesives.  However, finding a thermal epoxy that is easy to use and does not slow down production due to long cure times is difficult.  The 50-3112 Thermally Conductive Epoxy has been developed to assist manufacturers with thermal management issues while offering a quick cure, and easy application solution.

50-3112 is packaged in the convenient TriggerBond® dual barrel cartridge system.  This allows users to easily apply the epoxy with accuracy.  Perhaps the most impressive feature of the 50-3112 is the development of the adhesive strength within four hours at room temperature.  After just four hours the lap shear strength is 1,400 psi and after twenty-four hours reaches a strength of over 2,200 psi.

The 50-3112 is electrically insulating and thermally conductive so it may be used in many electronic devices.  It is a good choice for bonding heat sinks or anywhere a strong bond with good heat transfer is required.

Attached is a Technical Bulletin that provides more information about the 50-3112 Thermally Conductive Epoxy Adhesive.

Samples are readily available and ship within three days.

Silver Filled Epoxy vs. Solder

SyringeswithDispenserHolderandNeedles_Cropped_0x250Silver-filled epoxy adhesives are being used to replace solder in a number of applications. Due to their broader processability, electrically conductive adhesives can be an excellent option to solder in either a manufacturing setting or a repair operation.

Conductive epoxy tends to be less brittle than solder and there is much less likelihood of wicking up leads during application. Epoxy adhesives do not require flux and can adhere to surfaces that are not practical for traditional soldering (aluminum, glass, ceramics).

Silver epoxies can cure at room temperature or low elevated temperatures, making them ideal for processing on heat sensitive substrates. Because there is less shrinkage, conductive epoxy creates less stress at the bond area.

40-3900 and 40-3905 are two component epoxy adhesives filled with pure silver. They are lead free and contain no VOC’s. They have been engineered to satisfy the requirements of many demanding bonding applications that require electrical and thermal conductivity. The conductive silver epoxy products are often selected as cold solder replacement adhesives for heat sensitive components.

FDA Compliant Epoxy Adhesives

Adhesives, Sealants and Potting Compounds Suitable for use in the

Food Processing Industry

TriggerBond with Background_310x130Epoxies, Etc. features many products considered safe for food contact.  Epoxy and urethane adhesives, sealants and potting compounds that are formulated to meet the Food and Drug Administration (FDA) regulations of Title 21 CFR 175.105 and 175.300 are permitted for use in indirect food contact applications.

Some examples of the applications where Epoxies, Etc. has formulated solutions in this area include:

  • Bonding stainless steel mesh used for screening dry goods
  • Sealing seams in food processing equipment
  • Encapsulating LED’s used in inspection equipment
  • Bonding knife handles
  • Form in Place gasket for machinery
  • Encapsulating electronic circuits/ printed circuit boards
  • Potting temperature probes


10-3062 Two component epoxy adhesive that features excellent adhesion, chemical resistance and electrical insulation. Packaged in convenient TriggerBond® Cartridges.

10-3063 White, higher viscosity version of 10-3062. Also packaged in TriggerBond.

20-3068 Two component epoxy potting compound with excellent chemical resistance and clarity

10-3033 Two component, thixotropic epoxy adhesive with excellent adhesion and chemical resistance.

20-3072 Two component epoxy potting compounds/sealants that are ideal for protecting electrical connections that may be exposed to chemicals.