Encapsulating and Potting Compounds
Listed below are several of our specialty formulated electronic insulating compounds. Epoxies, Etc.’s resins are used to protect, insulate, and conceal circuitry, components, and devices. These potting, casting and encapsulating compounds were formulated to satisfy the requirements of many demanding applications in the electronic, electrical, automotive, and aerospace industries.
These compounds have a variety of durometers and cure schedules to choose from. Not all products are listed, and custom formulations are available upon consultation.
Having trouble deciding on which of our products best meets your critical potting and encapsulating requirements? Then let us assist you in selecting a product by using our online Product Selection Form. If we do not have an existing product that meets your requirements, we will develop one!
EPOXIES, ETC. MAKES NO EXPRESS OR IMPLIED WARRANTIES OR MERCHANTABILITY, FITNESS OR OTHERWISE WITH RESPECT TO ITS PRODUCTS. The information in this brochure is based on data obtained by our own research and is considered reliable. However, no warranty is expressed or implied regarding the accuracy of these data, the results to be obtained from the use thereof, or that any such use will not infringe any patent. The properties given are typical values and are not intended for use in preparing specifications. This information is furnished upon the condition that the person receiving it shall make his own tests to determine the suitability thereof for his particular purpose.