Meridian Adhesives Group - The Science of Solutions

Eliminate The Mixing, Keep The Properties

If you struggle with the time and cost of mixing separate adhesive components, one-component epoxies can make your life a lot easier. Yet many one-part epoxies trade off some physical properties for ease of use. That’s not the case with our 50–3122 One-Component Epoxy.

Even though it requires no mixing, 50–3122 does not skimp on strength, thermal, electrical and other important properties. Here’s a closer look at what this unique one-component epoxy offers:

  • Strength across a wide temperature range. With a tensile strength of 9,500 psi, a lap shear strength of 2,500 psi and a t-peel strength of 30 pli, 50–3122 creates exceptionally strong bonds. And it maintains its strength over a wide temperature range of –60 to 205°C, making it a good choice for structural bonding applications subject to temperature extremes.
  • Impact and vibration tolerance. 50–3122 also has a high tensile modulus of 675,000 psi, which helps it withstand heavy impact loads, vibration and thermal shocks.
  • Thermal and electrical insulation. 50–3122 is more than strong. It also acts as both a thermal and electrical insulator with a thermal conductivity of 1.44 W/m•K and a dielectric strength of 370 Volts/mil. These insulating properties come into play in many electrical, aerospace, appliance, automotive and industrial bonding applications.
  • Chemical resistance and low outgassing. Epoxies in general offer great chemical resistance, and 50–3122 is no exception. As a solvent-free formulation, 50–3122 also meets NASA outgassing standards (ASTM E595–07).

As with any one-part epoxy formulation, 50–3122 requires heat curing. To learn more about the recommended cure schedule and other technical specifications, download our 50–3122 Technical Bulletin.

Heat Sink Bonding Epoxy Adhesive

Electronic devices have become part of every-day use.  Their design complexities, miniaturization, power consumption, and thermal management issues challenge OEM engineers. The 70-3812NC Aluminum Filled Epoxy Adhesive has been specifically designed for bonding heat sinks that require high thermal conductivity and strong structural bonds.

In addition to providing strong bonds and thermal conductivity, the 70-3812NC passes NASA’S outgassing requirements per ASTM E-595-07.  The viscosity of this material is ideal for bonded fin heat sink applications and pipe bonding in extruded aluminum base applications.

The 70-3812NC is a two component epoxy system formulated to be cured at room temperature or with mild heat.  The 10:1 mix ratio is easy for batch mixing or utilizing Meter Mix and Dispense Equipment.

Samples are readily available and ship within three days.

Potting Compounds and Adhesives for Power Electronic Applications

Today’s electronic assemblies have to perform in some of the harshest environments. Epoxies, Etc. has been formulating solutions for electronic circuitry and assemblies for over 25 years.

Several potting compounds and adhesives offered by Epoxies, Etc. are providing customers power management solutions.  Common applications include capacitors, power controls, heat sinks, military and aerospace electronics, and many transportation industry products.

  • 50-2369 FR. Thermally conductive and thermal shock resistant urethane. UL94 V-0 Listed.
  • 50-3150 FR. Thermally conductive epoxy that can provide an RTI rating of 130C with Catalyst 30. UL 94 V-0 Listed.
  • 50-3152 FR.  Easy to use 1:1 mix ratio thermally conductive epoxy. UL 94 V-0 Listed.
  • 70-3812 NC. Aluminum filled epoxy used in heat sink applications.  Widely accepted as a fin and copper tube bonding adhesive.

When you need a proven potting compound or adhesive for a power management solution contact Epoxies, Etc. Our experienced engineers are available to review your application.

Foam-In-Place Rigid Polyurethane (PUR) Foam

Rigid polyurethane foams are specified by engineers and design professionals for their unique set of physical properties.  For instance, the 20-2028 Polyurethane Foam was developed to offer reduced weight, low dielectric properties, durability, and strength.  These properties come in handy in many electronic, aerospace, automotive, and marine applications.

The 20-2028 Polyurethane is a closed cell foam with an easy to use 1:1 mix ratio.  The density of the finished product is 11 pounds per cubic foot and in molding applications is ready for demolding in 10-15 minutes.

The use of hydrochlorofluorocarbon (HCFC) materials is commonly used as a blowing agent in foams.  The 20-2028 Polyurethane does not contain any HCFC materials.  It is also safer to use since it does not contain MOCA or TDI.

New Medical Grade Adhesive, Sealant, and Encapsulant

custom_formulationsEpoxy adhesives, sealants and potting compounds must meet certain requirements in order to be considered for use within or as a part of a medical device. In addition to important cured properties such as hardness, temperature and chemical resistance, tensile strength and electrical insulation properties; the epoxy must also meet certain biocompatibility requirements.

The ISO 10993-5 Cytotoxicity Test is a fast, reliable and cost effective way to screen for candidate materials. It consists of exposing cells to the cured epoxy and watching for signs of toxicity (change in size or appearance of cells or disruption in their configuration).  20-3401 meets the ISO 10993-5 Cytotoxicity Test Method Acceptance Criteria and may be suitable for use in medical electronics and instrumentation.

20-3401 passes ISO 10993-5 Cytotoxicity Test and is an excellent indicator that it will not cause issues during FDA approval.  However, Epoxies, Etc. recommends independent testing for the final assembled product.

20-3401 is also RoHS and REACH compliant and is available in convenient FreezedBond® premixed and frozen syringes.

Optical and Semiconductor Grade Epoxy Resin

LEDBlueBulb1_300x250An Optical and Semiconductor Grade Epoxy Resin system has been developed for LED encapsulating, glob top encapsulation, fiber optics and as an underfill for flip chips.  The 20-3401 provides outstanding adhesion to glass, quartz, most plastics, and metals.   It is easy to work with, allows users a long working time, and easily flows at room temperature.   REACH and RoHS compliant, this epoxy resin is a good choice for electronic assemblies.  In addition, 20-3401 is available in the convenient FreezedBond® premixed and frozen syringes.  Samples of the 20-3401 Clear Epoxy are available.

Electrically Conductive Silver Filled Epoxy Adhesive

Electrically Conductive Silver Filled Epoxy AdhesiveEpoxies, Etc. has developed a fast curing thin film Electrically Conductive Adhesive.  Room temperature curing Electrically Conductive Adhesives are ideal for bonding and sealing applications that cannot utilize heat to cure the adhesive.  However, the down side to many of these materials is the extended room temperature cure of one to three days.  40-3907 has a thin film set time of ninety minutes at room temperature and within six hours is close to full hardness (Shore D 78).

40-3907 may be used as a repair material for electrical traces providing better chemical resistance and adhesion than conductive inks.  Other common applications for 40-3907 include solder replacement, EMI\RFI shielding, grounding, die attach, SMD attach, and flip chip attachments.

Epoxies, Etc. has been formulating solutions for electronic circuitry and assemblies for over 25 years.  Our chemists and engineers are able to provide application support.

UL Listed Potting and Encapsulating Compounds

Four of Epoxies, Etc.’s UL Listed Potting and Encapsulating Compounds are high-lighted on epoxies.com  All  four of the products pass the stringent self-extinguishing UL 94 V-0 test and are listed with Underwriters Laboratory.  The products offer different properties and satisfy a large variety of potting and encapsulating requirements.  PDF links to the Technical Bulletins are available along with informative videos.

20-2362                UL Listed Urethane Potting Compound

50-2369                UL Listed Urethane Thermally Conductive Potting Compound

50-3150                UL Listed Epoxy Thermally Conductive Potting Compound

50-3152                UL Listed Epoxy Thermally Conductive Potting Compound

Samples are available and may be requested by visiting the following link:

Sample Request or email sales@epoxies.com

Make Potted Parts Weigh Less

LightAsAFeather_150x166Lightweight (syntactic) potting compounds have been used for years in electronics due to their exceptional strength, stiffness, dimensional stability, buoyancy and water resistance. They feature low dielectric constant, low shrinkage on cure, low moisture absorption, outstanding thermal and mechanical shock resistance and weight savings. Similar chemistries have also been used in the manufacture of flotation devices and aerospace composites.

These unique polymers are made by incorporating hollow glass microspheres into a proprietary resin blend. Once cured, the polymer is thermally insulating, more transparent to electronics transmission and capable of withstanding temperatures between -65C and 235C (silicone).

A syntactic epoxy foam can end up being up to 1/3 the weight of a highly filled thermally conductive epoxy. If heat transfer is not needed and weight savings is necessary for design optimization, these easy to use, closed cell potting compounds are the best choices.

20-3035 is a two component epoxy that can be used with a variety of curing agents to create a tough, thermally insulative and lightweight casting.

20-1634 is a two component silicone potting compound that provides flexible and stress free castings capable of operating over a very broad temperature range.

One Component Epoxy Engineered For Electronic Applications

lack Potting PCBMixing and proportioning of two component epoxy systems is time consuming and prone to processing errors.  The 20-3213 is a one component heat cure system designed for electronic applications requiring excellent dielectric properties.  No more weighing and mixing.

20-3213 is low in viscosity (3,000 cps) allowing for easy flow and quick processing. It can be used as an impregnating compound in electrical laminations, a potting compound, and an underfill encapsulant.  Once cured, the epoxy provides excellent moisture protection and electrical insulation properties.

A popular packaging option for the 20-3213 is pre-filled 10, 30, or 55cc syringes.  One and five gallon bulk packaging is also available.

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