Potting Compounds and Adhesives for Power Electronic Applications
Today’s electronic assemblies have to perform in some of the harshest environments. Epoxies, Etc. has been formulating solutions for electronic circuitry and assemblies for over 25 years.
Several potting compounds and adhesives offered by Epoxies, Etc. are providing customers power management solutions. Common applications include capacitors, power controls, heat sinks, military and aerospace electronics, and many transportation industry products.
- 50-2369 FR. Thermally conductive and thermal shock resistant urethane. UL94 V-0 Listed.
- 50-3150 FR. Thermally conductive epoxy that can provide an RTI rating of 130C with Catalyst 30. UL 94 V-0 Listed.
- 50-3152 FR. Easy to use 1:1 mix ratio thermally conductive epoxy. UL 94 V-0 Listed.
- 70-3812 NC. Aluminum filled epoxy used in heat sink applications. Widely accepted as a fin and copper tube bonding adhesive.
When you need a proven potting compound or adhesive for a power management solution contact Epoxies, Etc. Our experienced engineers are available to review your application.