Author: epoxieuser

Today’s electronic assemblies have to perform in some of the harshest environments. Epoxies, Etc. has been formulating solutions for electronic circuitry and assemblies for over 25 years.

Several potting compounds and adhesives offered by Epoxies, Etc. are providing customers power management solutions.  Common applications include capacitors, power controls, heat sinks, military and aerospace electronics, and many transportation industry products.

• 50-2369 FR. Thermally conductive and thermal shock resistant urethane. UL94 V-0 Listed.
• 50-3150 FR. Thermally conductive epoxy that can provide an RTI rating of 130C with Catalyst 30. UL 94 V-0 Listed.
• 50-3152 FR.  Easy to use 1:1 mix ratio thermally conductive epoxy. UL 94 V-0 Listed.
• 70-3812 NC. Aluminum filled epoxy used in heat sink applications.  Widely accepted as a fin and copper tube bonding adhesive.

When you need a proven potting compound or adhesive for a power management solution contact Epoxies, Etc. Our experienced engineers are available to review your application.

Rigid polyurethane foams are specified by engineers and design professionals for their unique set of physical properties.  For instance, the 20-2028 Polyurethane Foam was developed to offer reduced weight, low dielectric properties, durability, and strength.  These properties come in handy in many electronic, aerospace, automotive, and marine applications.

The 20-2028 Polyurethane is a closed cell foam with an easy to use 1:1 mix ratio.  The density of the finished product is 11 pounds per cubic foot and in molding applications is ready for demolding in 10-15 minutes.

The use of hydrochlorofluorocarbon (HCFC) materials is commonly used as a blowing agent in foams.  The 20-2028 Polyurethane does not contain any HCFC materials.  It is also safer to use since it does not contain MOCA or TDI.

Epoxy adhesives, sealants and potting compounds must meet certain requirements in order to be considered for use within or as a part of a medical device. In addition to important cured properties such as hardness, temperature and chemical resistance, tensile strength and electrical insulation properties; the epoxy must also meet certain biocompatibility requirements.

The ISO 10993-5 Cytotoxicity Test is a fast, reliable and cost effective way to screen for candidate materials. It consists of exposing cells to the cured epoxy and watching for signs of toxicity (change in size or appearance of cells or disruption in their configuration).  20-3401 meets the ISO 10993-5 Cytotoxicity Test Method Acceptance Criteria and may be suitable for use in medical electronics and instrumentation.

20-3401 passes ISO 10993-5 Cytotoxicity Test and is an excellent indicator that it will not cause issues during FDA approval.  However, Epoxies, Etc. recommends independent testing for the final assembled product.

20-3401 is also RoHS and REACH compliant and is available in convenient FreezedBond® premixed and frozen syringes.

An Optical and Semiconductor Grade Epoxy Resin system has been developed for LED encapsulating, glob top encapsulation, fiber optics and as an underfill for flip chips.  The 20-3401 provides outstanding adhesion to glass, quartz, most plastics, and metals.   It is easy to work with, allows users a long working time, and easily flows at room temperature.   REACH and RoHS compliant, this epoxy resin is a good choice for electronic assemblies.  In addition, 20-3401 is available in the convenient FreezedBond® premixed and frozen syringes.  Samples of the 20-3401 Clear Epoxy are available.

Epoxies, Etc. has developed a fast curing thin film Electrically Conductive Adhesive.  Room temperature curing Electrically Conductive Adhesives are ideal for bonding and sealing applications that cannot utilize heat to cure the adhesive.  However, the down side to many of these materials is the extended room temperature cure of one to three days.  40-3907 has a thin film set time of ninety minutes at room temperature and within six hours is close to full hardness (Shore D 78).

40-3907 may be used as a repair material for electrical traces providing better chemical resistance and adhesion than conductive inks.  Other common applications for 40-3907 include solder replacement, EMI\RFI shielding, grounding, die attach, SMD attach, and flip chip attachments.

Epoxies, Etc. has been formulating solutions for electronic circuitry and assemblies for over 25 years.  Our chemists and engineers are able to provide application support.

Four of Epoxies, Etc.’s UL Listed Potting and Encapsulating Compounds are high-lighted on epoxies.com  All  four of the products pass the stringent self-extinguishing UL 94 V-0 test and are listed with Underwriters Laboratory.  The products offer different properties and satisfy a large variety of potting and encapsulating requirements.  PDF links to the Technical Bulletins are available along with informative videos.

20-2362                UL Listed Urethane Potting Compound

50-2369                UL Listed Urethane Thermally Conductive Potting Compound

50-3150                UL Listed Epoxy Thermally Conductive Potting Compound

50-3152                UL Listed Epoxy Thermally Conductive Potting Compound

Samples are available and may be requested by visiting the following link:

Sample Request or email sales@epoxies.com

Mixing and proportioning of two component epoxy systems is time consuming and prone to processing errors.  The 20-3213 is a one component heat cure system designed for electronic applications requiring excellent dielectric properties.  No more weighing and mixing.

20-3213 is low in viscosity (3,000 cps) allowing for easy flow and quick processing. It can be used as an impregnating compound in electrical laminations, a potting compound, and an underfill encapsulant.  Once cured, the epoxy provides excellent moisture protection and electrical insulation properties.

A popular packaging option for the 20-3213 is pre-filled 10, 30, or 55cc syringes.  One and five gallon bulk packaging is also available.

Electronic assemblies and delicate components increasingly need soft encapsulating materials to provide protection.  A unique series of Clear Silicone Gels (20-1700 Series) were developed to seal and protect electronics from vibration, mechanical stress, and shock.  They are also used to isolate circuits from moisture and contaminants while providing electrical insulation.

The 20-1700 Potting and Encapsulating Silicone Gels consist of four different products.  Users can select the cure speed and firmness of the gel that best suits their application.  Due to their excellent electrical properties, dielectric strength, and resistivity, the 20-1700 Series are used to encapsulate electronic components, junction boxes, power modules and LED’s.  They are formulated without solvents or other toxic materials.

The popular TriggerBond® dual barrel cartridge system is the preferred packaging option for the 20-1700 Series due to the quick gel time of the Silicone Gels.  TriggerBond 50ml, 200ml, and 400ml cartridges are available.