Author: epoxieuser

A major challenge for engineers is finding cost-effective Thermally Conductive Potting Compounds for medium to large potting applications. Many of the commercially available high performance products are not viable options due to the cost that they add to the electronic devices.  Also, most potting compounds create too much heat when curing in large mass sizes. 50-2151 FR has a low exothermic reaction temperature.  This Polyurethane Potting Compound was formulated to provide a good balance between cost and performance.

The 50-2151 FR is low in viscosity and ideal for potting or encapsulating delicate components.  This system provides outstanding thermal shock and excellent dielectric properties.  An additional feature is that 50-2151 FR is formulated to be flame retardant.

Sample the 50-2151 FR today!

Low outgassing Epoxy Adhesives and Epoxy Potting Compounds are sometimes required in aerospace, optical, and electro-optical applications.  NASA has set the standard for testing when it comes to outgassing requirements.  The two measurements that are used to screen materials are the Total Mass Loss (TML) and Collected Volatile Condensable Materials (CVCM) of the epoxy adhesive.

The NASA standard requirement is the Epoxy Adhesive or Epoxy Potting Compound must have a TML of less than 1% and CVCM of less than 0.1%.  Epoxies, Etc. has a number of products that meet NASA’s Low-Outgassing standard.  View the NASA Low-Outgassing Compliant Epoxies Bulletin to learn more about these products.

Samples of these products are available and ship within three business days.

Watch our NEW VIDEO and learn more about silver-filled epoxy adhesives.

Silver-filled epoxies are relied upon to securely join substrates and provide electrical and thermal conductivity in a variety of applications.  Electrically conductive epoxy adhesives are ideal for use on heat-sensitive substrates, for field repair, or where soldering to a surface is not practical.

By carefully blending silver particles with epoxy resin, a matrix is formed.  When the epoxy cures, the particles are locked in place and current is able to pass through the silver particles due to point-to-point contact.

For more information on Epoxies, Etc. and our silver-filled epoxy adhesives visit epoxies.com or email sales@epoxies.com.

Epoxies, Etc., an ISO 9001:2008 registered company, is a leading formulator of specialty epoxies, urethanes, silicones, and UV curable systems. Since opening our doors in 1987, we have taken great pride in our commitment to the research, innovative development, and consistent manufacturing of materials for today’s demanding applications.

70-3812NC provides amazing structural strength when bonding aluminum fins to aluminum base plates.  Many heat sink manufacturers are switching to this thermally conductive heat sink adhesive due to its 2,500 psi tensile lap shear strength (aluminum to aluminum).  The 70-3812NC Aluminum Filled Epoxy is the go-to material for heat sink bonding.

In addition to providing strong bonds and thermal conductivity, the 70-3812NC passes NASA’s outgassing requirements per ASTM E-595-07.  This is a two-component epoxy system formulated to be cured at room temperature or with mild heat.  The 10:1 mix ratio is easy for batch mixing or utilizing Meter Mix and Dispense Equipment.

Request a sample today and discover the strength of the 70-3812NC Epoxy Adhesive.

A Tips and Tricks Video has been released on Choosing A Packaging Option for epoxy, urethane, and silicone formulations.  This video describes the benefits of different packaging options and helps engineers choose the best packaging for the application. Hinge Packs, TriggerBond, FreezeBond, and common bulk packaging are explained in this video.

For more Tips and Tricks and Knowledge That Sticks visit our Tips and Tricks Page.  More Tips and Tricks Videos will soon be released.

Stop The Dripping Before It Starts

Many Encapsulants and Potting Compounds are used in cable assemblies and connectors where the product needs to flow into and around tight spaces, but must not leak out of the mold. 20-2162 has been developed with a unique blend of properties that, in addition to providing outstanding protection, gives the user the flow control necessary for demanding applications.

20-2162 is low enough in viscosity to fill a populated area with a void free, high performance urethane, yet it will gel in minutes to prevent leaking into unwanted areas. The cured urethane has a Shore A durometer of 60A and an elongation of 200%.

Conveniently packaged in easy to use TriggerBond cartridges, 20-2162 provides superior protection from dust, moisture, humidity and outdoor conditions. It has excellent adhesion to a variety of substrates.

Samples are available and ship within 3 days.

Managing heat in electronic assemblies is a challenge for countless manufacturers. Many assemblies require the use of  thermally conductive adhesives.  However, finding a thermal epoxy that is easy to use and does not slow down production due to long cure times is difficult.  The 50-3112 Thermally Conductive Epoxy has been developed to assist manufacturers with thermal management issues while offering a quick cure, and easy application solution.

50-3112 is packaged in the convenient TriggerBond® dual barrel cartridge system.  This allows users to easily apply the epoxy with accuracy.  Perhaps the most impressive feature of the 50-3112 is the development of the adhesive strength within four hours at room temperature.  After just four hours the lap shear strength is 1,400 psi and after twenty-four hours reaches a strength of over 2,200 psi.

The 50-3112 is electrically insulating and thermally conductive so it may be used in many electronic devices.  It is a good choice for bonding heat sinks or anywhere a strong bond with good heat transfer is required.

Attached is a Technical Bulletin that provides more information about the 50-3112 Thermally Conductive Epoxy Adhesive.

Samples are readily available and ship within three days.