A major challenge for engineers is finding cost-effective Thermally Conductive Potting Compounds for medium to large potting applications. Many of the commercially available high performance products are not viable options due to the cost that they add to the electronic devices. Also, most potting compounds create too much heat when curing in large mass sizes. 50-2151 FR has a low exothermic reaction temperature. This Polyurethane Potting Compound was formulated to provide a good balance between cost and performance.
The 50-2151 FR is low in viscosity and ideal for potting or encapsulating delicate components. This system provides outstanding thermal shock and excellent dielectric properties. An additional feature is that 50-2151 FR is formulated to be flame retardant.