Meridian Adhesives Group - The Science of Solutions

COVID-19 Update

As COVID-19 continues to impact the global community, I want to personally update you on the steps we have taken to protect business continuity for all our customers. It goes without saying that, while ensuring the success of our customers is a primary focus, the health and safety of our employees, customers, partners and their families are paramount. 

Based on the guidance from the World Health Organization, we have reinforced our daily operations with specific steps to account for COVID-19.  

  1. We are closely following guidelines set by the CDC to mitigate risk to our employees and customers.
  2. We are advising against international travel at this time, and encouraging any necessary domestic travel be done responsibly.
  3. We have asked all employees to take recommended precautions to prevent exposing themselves to a possible infection and also to help stop the spread of the pandemic – any employee that has remote suspicion that they may be infected has been advised to remain at home and seek medical attention.
  4. We have instructed employees to leverage technology at our disposal and conduct internal and external meetings virtually as much as possible.
  5. We are working to move all internal and external events, such as marketing conferences, trainings, customer presentations, etc. to virtual platforms. Customers requiring in-person assistance will continue to receive it, as we realize our customers are also trying to continue servicing their own clients in the face of this temporary obstacle.

We appreciate your trust in our team, and we will continue to provide you with the level of support that you have come to expect. Your sales representative will be in communication with you as we work through this situation together.

Optically Clear Potting Compounds

Epoxies, Etc. formulates a variety of solutions for applications that require water clear potting compounds. Epoxies, Etc. offers optically clear silicones, urethanes, and epoxies that could work for your application. Below are details on three potting compounds, click on the part number to get more information on the product.
Optically clear, low viscosity silicone that offers customers an easy 1:1 mix ratio. This silicone provides a soft, flexible potting compound that won’t put stress on components and will not yellow over time. Great for high temperature (200°C) applications. Offered in TriggerBond™ cartridges.

Water clear urethane with excellent environment resistance and low viscosity. This 1:1, non-yellowing compound offers excellent adhesion and flexibility and is a great choice for outdoor applications that will see extended UV exposure or extreme weather. Offered in TriggerBond™ cartridges.

Very low viscosity, water clear potting compound. This rigid epoxy offers the highest adhesion and best chemical resistance of the optically clear potting compounds. Easy to work with 2:1 mix ratio cures bubble free and glass smooth. Offered in TriggerBond™ cartridges.

To request a sample of one of these materials, or to ask an expert on which clear product would be best for your application, please fill out Epoxies, Etc.’s Sample Request Form

Thermally Conductive Potting Compound-Formulated for large potting applications

Black Potting PCB Cropped_400x338A major challenge for engineers is finding cost-effective Thermally Conductive Potting Compounds for medium to large potting applications. Many of the commercially available high performance products are not viable options due to the cost that they add to the electronic devices.  Also, most potting compounds create too much heat when curing in large mass sizes. 50-2151 FR has a low exothermic reaction temperature.  This Polyurethane Potting Compound was formulated to provide a good balance between cost and performance.

The 50-2151 FR is low in viscosity and ideal for potting or encapsulating delicate components.  This system provides outstanding thermal shock and excellent dielectric properties.  An additional feature is that 50-2151 FR is formulated to be flame retardant.

Sample the 50-2151 FR today!

Low-Outgassing Epoxy Adhesives

opticallens_440x300Low outgassing Epoxy Adhesives and Epoxy Potting Compounds are sometimes required in aerospace, optical, and electro-optical applications.  NASA has set the standard for testing when it comes to outgassing requirements.  The two measurements that are used to screen materials are the Total Mass Loss (TML) and Collected Volatile Condensable Materials (CVCM) of the epoxy adhesive.

The NASA standard requirement is the Epoxy Adhesive or Epoxy Potting Compound must have a TML of less than 1% and CVCM of less than 0.1%.  Epoxies, Etc. has a number of products that meet NASA’s Low-Outgassing standard.  View the NASA Low-Outgassing Compliant Epoxies Bulletin to learn more about these products.

Samples of these products are available and ship within three business days.

New Video: Silver Filled Electrically Conductive Epoxies

Watch our NEW VIDEO and learn more about silver-filled epoxy adhesives.

Silver-filled epoxies are relied upon to securely join substrates and provide electrical and thermal conductivity in a variety of applications.  Electrically conductive epoxy adhesives are ideal for use on heat-sensitive substrates, for field repair, or where soldering to a surface is not practical.

By carefully blending silver particles with epoxy resin, a matrix is formed.  When the epoxy cures, the particles are locked in place and current is able to pass through the silver particles due to point-to-point contact.

For more information on Epoxies, Etc. and our silver-filled epoxy adhesives visit or email

Epoxies, Etc., an ISO 9001:2008 registered company, is a leading formulator of specialty epoxies, urethanes, silicones, and UV curable systems. Since opening our doors in 1987, we have taken great pride in our commitment to the research, innovative development, and consistent manufacturing of materials for today’s demanding applications.

Fast Curing Toughened Epoxy Adhesive

10-3041-small-5683Epoxy adhesives offer many advantages over traditional mechanical fasteners such as rivets, nuts and bolts, pins, or welding.  However, conventional two part epoxies that offer excellent bonds can be slow curing.  The new 10-3041 Toughened Epoxy Adhesive develops a 3,000 psi lap shear strength within four hours.  Within minutes the material is dry to the touch.

Epoxy adhesives save time and reduce weight.  This is why the aerospace industry prefers using epoxy adhesives over mechanical fasteners.  The 10-3041 high performance epoxy adhesive forms excellent bonds to a variety of plastics and metals.  It also acts as an outstanding electrical insulator and therefore is suitable for many electronic bonding applications.

For easy application, the 10-3041 is packaged in the convenient TriggerBond® system which eliminates the weighing and mixing of a two part epoxy.

Samples are readily available and ship within three days.

Heat Sink Fin Bonding Epoxy Adhesive

Epoxies_Etc-small-566870-3812NC provides amazing structural strength when bonding aluminum fins to aluminum base plates.  Many heat sink manufacturers are switching to this thermally conductive heat sink adhesive due to its 2,500 psi tensile lap shear strength (aluminum to aluminum).  The 70-3812NC Aluminum Filled Epoxy is the go-to material for heat sink bonding.

In addition to providing strong bonds and thermal conductivity, the 70-3812NC passes NASA’s outgassing requirements per ASTM E-595-07.  This is a two-component epoxy system formulated to be cured at room temperature or with mild heat.  The 10:1 mix ratio is easy for batch mixing or utilizing Meter Mix and Dispense Equipment.

Request a sample today and discover the strength of the 70-3812NC Epoxy Adhesive.


Epoxy potting compounds are used to protect electronics from dust, moisture and chemicals. They can also insulate, conduct heat or provide protection from physical or thermal shock.

Filling a large electronic assembly with an epoxy potting compound can be especially challenging due to the large mass. Selecting the wrong epoxy mixture can lead to a dangerous exothermic reaction or too much shrinkage. An exothermic reaction can produce enough heat to damage the components that the epoxy was intended to protect. Excess shrinkage can create stress on components or create cracks in the epoxy when cured.

50-3150FR, when cured with Catalyst 12, was designed to overcome these challenges. This flame retardant, thermally conductive epoxy has a low mixed viscosity that makes it easy to create a void free fill in a deep section. Specially selected fillers in the formulation help to not only conduct heat, but also minimize the heat generated during the reaction. Since there is minimal shrinkage upon curing at room temperature, the 50-3150FR does not create any stress on delicate components.

Samples are readily available and ship within 3 days.

Tips & Tricks Video; Choosing A Packaging Option

A Tips and Tricks Video has been released on Choosing A Packaging Option for epoxy, urethane, and silicone formulations.  This video describes the benefits of different packaging options and helps engineers choose the best packaging for the application. Hinge Packs, TriggerBond, FreezeBond, and common bulk packaging are explained in this video.

For more Tips and Tricks and Knowledge That Sticks visit our Tips and Tricks Page.  More Tips and Tricks Videos will soon be released.

Control The Flow Of The Potting Compound

Stop The Dripping Before It Starts

Many Encapsulants and Potting Compounds are used in cable assemblies and connectors where the product needs to flow into and around tight spaces, but must not leak out of the mold. 20-2162 has been developed with a unique blend of properties that, in addition to providing outstanding protection, gives the user the flow control necessary for demanding applications.

20-2162 is low enough in viscosity to fill a populated area with a void free, high performance urethane, yet it will gel in minutes to prevent leaking into unwanted areas. The cured urethane has a Shore A durometer of 60A and an elongation of 200%.

Conveniently packaged in easy to use TriggerBond cartridges, 20-2162 provides superior protection from dust, moisture, humidity and outdoor conditions. It has excellent adhesion to a variety of substrates.

Samples are available and ship within 3 days.