A new fast curing Aluminum Filled Epoxy Adhesive (70-3814) was developed by Epoxies, Etc.  This thermally conductive adhesive has 1,000 psi of strength in just four hours!  After twenty-four hours the Lap Shear Strength is 2,900 psi.

70-3814 offers fast heat dissipation for a wide range of assembly applications.  The Thermal Conductivity is 1.80 W/m- °K.  The quick heat dissipation makes this a popular choice for many heat sink bonding applications. For ease of use this product is offered in the convenient TriggerBond® cartridge system.

Popular Features:

• Strong bond strength develops quickly
• Thermally conductive adhesive transfers heat quickly
• Packaged in the convenient TriggerBond® dual barrel dispensing system
• Vibration and impact resistance helps hold parts together in tough environments

Epoxies, Etc. has been formulating solutions for electronic circuitry and assemblies for over 30 years.  Our chemists and engineers are able to provide specific application support. Technical Support can be reached by phone 401-946-5564 or sales@epoxies.com.

Samples ship within 3 business days!

Many potting compounds and adhesives offered by Epoxies, Etc. are providing customers power management solutions.  Common applications include capacitors, power controls, heat sinks, military and aerospace electronics, and many transportation industry products.

The new Potting Compounds and Adhesives for Power Electronic Applications brochure high-lights twelve products.  These products are performing well in some of the most demanding and harshest environments.

Epoxies, Etc. will be exhibiting at the Applied Power Electronics Conference located in San Antonio, March 5-8.  Come by an visit us in booth 859.

Get Exactly What You Need

Why settle for an off-the-shelf formulation that’s less than perfect?  We’ve built our business around providing custom epoxy, silicone and urethane solutions, formulated to our customer’s exact specifications.

With Epoxies, Etc. there’s no premium pricing or long lead times for custom formulations. We will quickly develop a custom formulation to help you gain a competitive advantage.

Custom Formulation for Every Application

Whether it’s small batch, tweaking an existing product or developing a proprietary formulation from scratch, our Technical Experts will work with you every step of the way.

VIDEO LINK

Watch our Customization Video.

Get Started

It’s easy to get started on a Customized Formulation for your application by completing the Product Selection Form.

Or call us today at 1-800-Epoxies (376-9437).

New Video: Custom Epoxy, Urethane, and Silicone Formulations

One of the biggest pain points when applying two-part adhesives involves mixing mistakes. Even the most careful workers will make errors when combining the adhesive components, which can result in cure problems, excess shrinkage and loss of physical properties. Fortunately, there’s a foolproof way to avoid these costly mixing errors.

Our TriggerBond® system packages an adhesive’s two components into their own cartridges, which fit in a dual-barrel dispensing gun. Because the cartridges contain precise quantities of the hardener and resin, TriggerBond produces the perfect mix ratio every time you squeeze the trigger. And with cartridge volumes ranging from 50 to 400 ml, TriggerBond addresses prototype through production volumes.

Not every adhesive or potting compound lends itself to TriggerBond packaging, but many do. Among the most popular are our family of fast-cure epoxies, each with a different setting time:

• 10–3005 sets in 5 minutes.
• 10–3020 sets in 20 minutes.
• 10–3046 sets in 46 minutes.

All three cure at room temperature and work with a wide variety of metal, ceramic and polymer substrates in electronics, industrial and jewelry applications. They’re available in black or clear as well as in different consistencies—such as high viscosity and non-sag.

With shear strength up to 1,500 psi and notched Izod impact of 2.7 ft-lb/in, all three epoxies offer high-bond and impact strengths for structural bonding applications.

For a more detailed look at physical properties and application instructions, download the Fast Cure Epoxies Technical Bulletin.  Or contact us for a free sample today.

20-2121 is formulated for electronic potting, encapsulating and casting applications.This polyurethane resin system is a two component, low viscosity, low toxicity, room temperature curing system.  20-2121 was designed for specifically for potting and encapsulating sensitive electronic components.  It will impart very little stress on components during and after cure.

The base Natural Oil Polyol (NOP) used in 20-2121 is obtained directly from a plant source without chemical modifications.  Due to the raw materials selected, this product is low in toxicity and considered a GREEN Potting Compound.

Epoxies, Etc. has been formulating epoxy, urethane, and silicone solutions for electronic circuitry and assemblies for over 25 years.  Samples are available and ship within three business days.

A series of flexible urethane elastomers are replacing high cost silicones in many electronic applications.  Like silicones, the 20-2330 Urethane Series provides flexibility and elongation for potting and encapsulating applications.  Unlike silicones, the urethanes provide better abrasion resistance, adhesion, and are not subject to cure inhibition when exposed to sulfur, amines and tin salts.

The 20-2330 Series range in hardness from Shore A 30-90.  They have a low glass transition temperature of -70°C and excellent hydrolytic stability.  Similar to silicones the products provide low embedment stress to sensitive electronic components.

Engineers no longer have to specify high cost silicones for applications requiring low durometer materials. The 20-2330 Urethane Elastomers are low in durometer and offer additional  benefits. Silicones are still a good choice in high temperature (135° to 200°C) applications that require soft materials.

Epoxies, Etc. has been formulating epoxy, urethane, and silicone solutions for electronic circuitry and assemblies for over 25 years.  Contact our technical service engineers to learn more about the 20-2330 Urethane Series.  Samples are available and ship within three days.

Today’s electronic assemblies have to perform in some of the harshest environments. Epoxies, Etc. has been formulating solutions for electronic circuitry and assemblies for over 25 years.

Several potting compounds and adhesives offered by Epoxies, Etc. are providing customers power management solutions.  Common applications include capacitors, power controls, heat sinks, military and aerospace electronics, and many transportation industry products.

• 50-2369 FR. Thermally conductive and thermal shock resistant urethane. UL94 V-0 Listed.
• 50-3150 FR. Thermally conductive epoxy that can provide an RTI rating of 130C with Catalyst 30. UL 94 V-0 Listed.
• 50-3152 FR.  Easy to use 1:1 mix ratio thermally conductive epoxy. UL 94 V-0 Listed.
• 70-3812 NC. Aluminum filled epoxy used in heat sink applications.  Widely accepted as a fin and copper tube bonding adhesive.

When you need a proven potting compound or adhesive for a power management solution contact Epoxies, Etc. Our experienced engineers are available to review your application.

Rigid polyurethane foams are specified by engineers and design professionals for their unique set of physical properties.  For instance, the 20-2028 Polyurethane Foam was developed to offer reduced weight, low dielectric properties, durability, and strength.  These properties come in handy in many electronic, aerospace, automotive, and marine applications.

The 20-2028 Polyurethane is a closed cell foam with an easy to use 1:1 mix ratio.  The density of the finished product is 11 pounds per cubic foot and in molding applications is ready for demolding in 10-15 minutes.

The use of hydrochlorofluorocarbon (HCFC) materials is commonly used as a blowing agent in foams.  The 20-2028 Polyurethane does not contain any HCFC materials.  It is also safer to use since it does not contain MOCA or TDI.

Epoxy adhesives, sealants and potting compounds must meet certain requirements in order to be considered for use within or as a part of a medical device. In addition to important cured properties such as hardness, temperature and chemical resistance, tensile strength and electrical insulation properties; the epoxy must also meet certain biocompatibility requirements.

The ISO 10993-5 Cytotoxicity Test is a fast, reliable and cost effective way to screen for candidate materials. It consists of exposing cells to the cured epoxy and watching for signs of toxicity (change in size or appearance of cells or disruption in their configuration).  20-3401 meets the ISO 10993-5 Cytotoxicity Test Method Acceptance Criteria and may be suitable for use in medical electronics and instrumentation.

20-3401 passes ISO 10993-5 Cytotoxicity Test and is an excellent indicator that it will not cause issues during FDA approval.  However, Epoxies, Etc. recommends independent testing for the final assembled product.

20-3401 is also RoHS and REACH compliant and is available in convenient FreezedBond® premixed and frozen syringes.

An Optical and Semiconductor Grade Epoxy Resin system has been developed for LED encapsulating, glob top encapsulation, fiber optics and as an underfill for flip chips.  The 20-3401 provides outstanding adhesion to glass, quartz, most plastics, and metals.   It is easy to work with, allows users a long working time, and easily flows at room temperature.   REACH and RoHS compliant, this epoxy resin is a good choice for electronic assemblies.  In addition, 20-3401 is available in the convenient FreezedBond® premixed and frozen syringes.  Samples of the 20-3401 Clear Epoxy are available.