Silver-filled epoxy adhesives are being used to replace solder in a number of applications. Due to their broader processability, electrically conductive adhesives can be an excellent option to solder in either a manufacturing setting or a repair operation.

Conductive epoxy tends to be less brittle than solder and there is much less likelihood of wicking up leads during application. Epoxy adhesives do not require flux and can adhere to surfaces that are not practical for traditional soldering (aluminum, glass, ceramics).

Silver epoxies can cure at room temperature or low elevated temperatures, making them ideal for processing on heat sensitive substrates. Because there is less shrinkage, conductive epoxy creates less stress at the bond area.

40-3900 and 40-3905 are two component epoxy adhesives filled with pure silver. They are lead free and contain no VOC’s. They have been engineered to satisfy the requirements of many demanding bonding applications that require electrical and thermal conductivity. The conductive silver epoxy products are often selected as cold solder replacement adhesives for heat sensitive components.

A Tips and Tricks Video has been released on Choosing The Right Chemistry.   This video helps answer the question; Should I use an epoxy, urethane, or silicone in my application?  Each chemistry offers unique properties that provide distinct advantages.  For example, when chemical resistance and rigidity is required an epoxy is tough to beat!

For more Tips and Tricks and Knowledge That Sticks visit our Tips and Tricks Page.  More Tips and Tricks Videos will soon be released.

A new fast curing Aluminum Filled Epoxy Adhesive (70-3814) was developed by Epoxies, Etc.  This thermally conductive adhesive has 1,000 psi of strength in just four hours!  After twenty-four hours the Lap Shear Strength is 2,900 psi.

70-3814 offers fast heat dissipation for a wide range of assembly applications.  The Thermal Conductivity is 1.80 W/m- °K.  The quick heat dissipation makes this a popular choice for many heat sink bonding applications. For ease of use this product is offered in the convenient TriggerBond® cartridge system.

Popular Features:

• Strong bond strength develops quickly
• Thermally conductive adhesive transfers heat quickly
• Packaged in the convenient TriggerBond® dual barrel dispensing system
• Vibration and impact resistance helps hold parts together in tough environments

Epoxies, Etc. has been formulating solutions for electronic circuitry and assemblies for over 30 years.  Our chemists and engineers are able to provide specific application support. Technical Support can be reached by phone 401-946-5564 or sales@epoxies.com.

Samples ship within 3 business days!

Many potting compounds and adhesives offered by Epoxies, Etc. are providing customers power management solutions.  Common applications include capacitors, power controls, heat sinks, military and aerospace electronics, and many transportation industry products.

The new Potting Compounds and Adhesives for Power Electronic Applications brochure high-lights twelve products.  These products are performing well in some of the most demanding and harshest environments.

Epoxies, Etc. will be exhibiting at the Applied Power Electronics Conference located in San Antonio, March 5-8.  Come by an visit us in booth 859.

Get Exactly What You Need

Why settle for an off-the-shelf formulation that’s less than perfect?  We’ve built our business around providing custom epoxy, silicone and urethane solutions, formulated to our customer’s exact specifications.

With Epoxies, Etc. there’s no premium pricing or long lead times for custom formulations. We will quickly develop a custom formulation to help you gain a competitive advantage.

Custom Formulation for Every Application

Whether it’s small batch, tweaking an existing product or developing a proprietary formulation from scratch, our Technical Experts will work with you every step of the way.

VIDEO LINK

Watch our Customization Video.

Get Started

It’s easy to get started on a Customized Formulation for your application by completing the Product Selection Form.

Or call us today at 1-800-Epoxies (376-9437).

New Video: Custom Epoxy, Urethane, and Silicone Formulations

One of the biggest pain points when applying two-part adhesives involves mixing mistakes. Even the most careful workers will make errors when combining the adhesive components, which can result in cure problems, excess shrinkage and loss of physical properties. Fortunately, there’s a foolproof way to avoid these costly mixing errors.

Our TriggerBond® system packages an adhesive’s two components into their own cartridges, which fit in a dual-barrel dispensing gun. Because the cartridges contain precise quantities of the hardener and resin, TriggerBond produces the perfect mix ratio every time you squeeze the trigger. And with cartridge volumes ranging from 50 to 400 ml, TriggerBond addresses prototype through production volumes.

Not every adhesive or potting compound lends itself to TriggerBond packaging, but many do. Among the most popular are our family of fast-cure epoxies, each with a different setting time:

• 10–3005 sets in 5 minutes.
• 10–3020 sets in 20 minutes.
• 10–3046 sets in 46 minutes.

All three cure at room temperature and work with a wide variety of metal, ceramic and polymer substrates in electronics, industrial and jewelry applications. They’re available in black or clear as well as in different consistencies—such as high viscosity and non-sag.

With shear strength up to 1,500 psi and notched Izod impact of 2.7 ft-lb/in, all three epoxies offer high-bond and impact strengths for structural bonding applications.

For a more detailed look at physical properties and application instructions, download the Fast Cure Epoxies Technical Bulletin.  Or contact us for a free sample today.

20-2121 is formulated for electronic potting, encapsulating and casting applications.This polyurethane resin system is a two component, low viscosity, low toxicity, room temperature curing system.  20-2121 was designed for specifically for potting and encapsulating sensitive electronic components.  It will impart very little stress on components during and after cure.

The base Natural Oil Polyol (NOP) used in 20-2121 is obtained directly from a plant source without chemical modifications.  Due to the raw materials selected, this product is low in toxicity and considered a GREEN Potting Compound.

Epoxies, Etc. has been formulating epoxy, urethane, and silicone solutions for electronic circuitry and assemblies for over 25 years.  Samples are available and ship within three business days.

A series of flexible urethane elastomers are replacing high cost silicones in many electronic applications.  Like silicones, the 20-2330 Urethane Series provides flexibility and elongation for potting and encapsulating applications.  Unlike silicones, the urethanes provide better abrasion resistance, adhesion, and are not subject to cure inhibition when exposed to sulfur, amines and tin salts.

The 20-2330 Series range in hardness from Shore A 30-90.  They have a low glass transition temperature of -70°C and excellent hydrolytic stability.  Similar to silicones the products provide low embedment stress to sensitive electronic components.

Engineers no longer have to specify high cost silicones for applications requiring low durometer materials. The 20-2330 Urethane Elastomers are low in durometer and offer additional  benefits. Silicones are still a good choice in high temperature (135° to 200°C) applications that require soft materials.

Epoxies, Etc. has been formulating epoxy, urethane, and silicone solutions for electronic circuitry and assemblies for over 25 years.  Contact our technical service engineers to learn more about the 20-2330 Urethane Series.  Samples are available and ship within three days.