Month: November 2016

An Optical and Semiconductor Grade Epoxy Resin system has been developed for LED encapsulating, glob top encapsulation, fiber optics and as an underfill for flip chips.  The 20-3401 provides outstanding adhesion to glass, quartz, most plastics, and metals.   It is easy to work with, allows users a long working time, and easily flows at room temperature.   REACH and RoHS compliant, this epoxy resin is a good choice for electronic assemblies.  In addition, 20-3401 is available in the convenient FreezedBond® premixed and frozen syringes.  Samples of the 20-3401 Clear Epoxy are available.

Epoxies, Etc. has developed a fast curing thin film Electrically Conductive Adhesive.  Room temperature curing Electrically Conductive Adhesives are ideal for bonding and sealing applications that cannot utilize heat to cure the adhesive.  However, the down side to many of these materials is the extended room temperature cure of one to three days.  40-3907 has a thin film set time of ninety minutes at room temperature and within six hours is close to full hardness (Shore D 78).

40-3907 may be used as a repair material for electrical traces providing better chemical resistance and adhesion than conductive inks.  Other common applications for 40-3907 include solder replacement, EMI\RFI shielding, grounding, die attach, SMD attach, and flip chip attachments.

Epoxies, Etc. has been formulating solutions for electronic circuitry and assemblies for over 25 years.  Our chemists and engineers are able to provide application support.