Category: News

50-3152FR Thermally Conductive Compound Self-Extinguishes and Mixes in Equal Parts

Epoxies, Etc. continues to formulate new products to meet industry need, this time creating a unique thermally conductive potting compound. While many thermally conductive compounds meet the stringent non-burning requirements of UL’s 94 V-0 standard, few have the added advantage of being thoroughly easy to use. With a low viscosity and 1:1 mix ratio, 50-3152FR has both desirable properties.

50-3152FR provides excellent electrical insulation and component protection. It has a resiliency not typically seen in epoxy potting compounds, reducing physical and thermal shock even further. This material pours easily creating a smooth, air free finish.

In addition, 50-3152FR is DOT friendly, RoHS and REACH compliant, and antimony free.

Features:

• Easy to use mix ratio of 1:1
• Thermally conductive
• UL Listed for passing 94 V-0 non-burning standard
• Resilient and tough
• Excellent thermal and physical protection
• Good air release
• Excellent electrical insulation
• DOT non-hazardous for shipping
• RoHS and REACH compliant
• Antimony free

Samples are available and may be requested by visiting the following link:

/sample/ or contacting Sales@epoxies.com.

10-3062, by Epoxies, Etc., is a two component epoxy compound that is easy to use and a good solution for applications where proper handling of wet or dry food materials is important.  10-3062 meets the Food and Drug Administration (FDA) regulations permitting use in “indirect” food contact applications.  The raw materials used in this product comply with the FDA regulations of Title 21 Code of Federal Regulations under Sections 175.105 and 175.300.

10-3062 is very effective as a sealant or adhesive for use with stainless steel and most plastics commonly used in the food preparation or packing industries.  It is available in the dual barrel TriggerBond® system and is therefore easily dispensed and cured with no weighing or mixing.

10-3062 cures at room temperature in 24 hours and the cure time can be accelerated with heat.

Features:

• Excellent adhesion
• Raw materials comply with FDA standards for indirect food contact
• Room temperature curing
• Available in TriggerBond® dual cartridge dispensing system

Electronics can produce a lot of heat. Epoxies, Etc. offers a solution with several thermally conductive potting compounds that protect your electronic components from the damages of overheating, stress and shock. They transfer heat well, have low shrinkage and exotherm, and excellent electrical insulation properties.

Each product was designed with unique characteristics to make it a good fit for a certain type of application.

50-1952
Flexible Silicone Potting Compound (1:1 mix ratio) with outstanding heat transfer and electrical properties from -65 to +235°C. It is solvent free and therefore will not release by-products on cure making it safer to handle than many of its counterparts and non-regulated for transport.

50-2369FR
UL listed Flame Retardant Polyurethane Potting Compound with excellent heat transfer and water resistance. This product is great for outdoor use.

50-3150FR
UL listed Flame Retardant Epoxy Potting Compound which transfers heat very quickly, has outstanding moisture and chemical resistance, and is free of bromine, halogen, and antimony. It is also compliant with REACH and RoHS standards. Ideal for encapsulating power supplies, transformers, coils, sensors, and more.

50-3152FR
Flame Retardant Epoxy Resin (1:1) designed for ease of use. It is semi-rigid offering excellent shock and vibration resistance and great thermal transfer.

50-3185NC
Filled Epoxy Potting and Encapsulating Compound with very low thermal expansion, outstanding electrical insulation, and high thermal conductivity. This material is ideal for high voltage applications. It meets NASA’s outgassing requirements.

Samples are available by contacting Sales@epoxies.com.

20-1650, by Epoxies, Etc., is a two component silicone elastomer designed specifically for applications where a large amount of heat is emitted such as in oil drilling or high voltage assemblies. Even for a silicone, which can operate under fairly high temperatures, 20-1650 outperforms. It operates in environments from -65°C to +300°C (or up to 572° F).

20-1650 has been specially formulated for increased thermal stability. It is very soft and flexible and moves with components, rather than cracking or shrinking under stress. This makes 20-1650 perfect for potting or encapsulating delicate components.

Other benefits to using this material include its easy 1:1 mix ratio, its relatively quick and air-free cure, and its ability to cure in deep sections (beyond 1-2 inches).

In a world increasingly concerned with the reduction of toxic chemicals and the expense of shipping them, 20-1650 has the advantage of being solvent free so it is safer to handle than many potting systems and is non-regulated for shipping.

Features:
• Unusually high operating temperature range
• Flexibility offers great vibration resistance
• Cures in thick sections
• Non-corrosive
• Good air release
• Easy 1:1 mix ratio
• Low in toxicity
• Not hazardous to ship

“Electronics Protection” magazine asked Epoxies, Etc. to share some expertise recently for a featured article in their May/June 2013 issue.  The purpose of the article was to help engineers select epoxy potting compounds for the protection of electronic components.

The full article, written by Al DeSisto, Director of Technical Sales at Epoxies, Etc., can be found here:

“Protecting and Improving Electronic Components Performance”