News & Blog
Electrically Conductive Silver Filled Epoxy Adhesive
Epoxies, Etc. has developed a fast curing thin film Electrically Conductive Adhesive. Room temperature curing Electrically Conductive Adhesives are ideal for bonding and sealing applications that cannot utilize heat to cure the adhesive. However, the down side to many of these materials is the extended room temperature cure of one to three days. 40-3907 has a thin […]
UL Listed Potting and Encapsulating Compounds
Four of Epoxies, Etc.’s UL Listed Potting and Encapsulating Compounds are high-lighted on epoxies.com All four of the products pass the stringent self-extinguishing UL 94 V-0 test and are listed with Underwriters Laboratory. The products offer different properties and satisfy a large variety of potting and encapsulating requirements. PDF links to the Technical Bulletins are available along with informative videos. 20-2362 UL […]
Make Potted Parts Weigh Less
Lightweight (syntactic) potting compounds have been used for years in electronics due to their exceptional strength, stiffness, dimensional stability, buoyancy and water resistance. They feature low dielectric constant, low shrinkage on cure, low moisture absorption, outstanding thermal and mechanical shock resistance and weight savings. Similar chemistries have also been used in the manufacture of flotation […]
One Component Epoxy Engineered For Electronic Applications
Mixing and proportioning of two component epoxy systems is time consuming and prone to processing errors. The 20-3213 is a one component heat cure system designed for electronic applications requiring excellent dielectric properties. No more weighing and mixing. 20-3213 is low in viscosity (3,000 cps) allowing for easy flow and quick processing. It can be used as an impregnating […]
Silicone Dielectric Gels Cushion and Protect Electronics
Electronic assemblies and delicate components increasingly need soft encapsulating materials to provide protection. A unique series of Clear Silicone Gels (20-1700 Series) were developed to seal and protect electronics from vibration, mechanical stress, and shock. They are also used to isolate circuits from moisture and contaminants while providing electrical insulation. The 20-1700 Potting and Encapsulating Silicone […]
Fast Curing Polyurethane Potting & Encapsulating Compound
High performance two component Potting and Encapsulating materials are known for their slow room temperature cure times. This becomes a frustrating productivity issue for many manufacturers. Epoxies, Etc. has a solution. A newly developed polyurethane cures within one hour at room temperature. The 20-2183 is unique because it does not have a high exothermic temperature […]
