News & Blog
Eliminate The Mixing, Keep The Properties
If you struggle with the time and cost of mixing separate adhesive components, one-component epoxies can make your life a lot easier. Yet many one-part epoxies trade off some physical properties for ease of use. That’s not the case with our 50–3122 One-Component Epoxy. Even though it requires no mixing, 50–3122 does not skimp on […]
Heat Sink Bonding Epoxy Adhesive
Electronic devices have become part of every-day use. Their design complexities, miniaturization, power consumption, and thermal management issues challenge OEM engineers. The 70-3812NC Aluminum Filled Epoxy Adhesive has been specifically designed for bonding heat sinks that require high thermal conductivity and strong structural bonds. In addition to providing strong bonds and thermal conductivity, the 70-3812NC passes NASA’S outgassing requirements per […]
Potting Compounds and Adhesives for Power Electronic Applications
Today’s electronic assemblies have to perform in some of the harshest environments. Epoxies, Etc. has been formulating solutions for electronic circuitry and assemblies for over 25 years. Several potting compounds and adhesives offered by Epoxies, Etc. are providing customers power management solutions. Common applications include capacitors, power controls, heat sinks, military and aerospace electronics, and […]
Foam-In-Place Rigid Polyurethane (PUR) Foam
Rigid polyurethane foams are specified by engineers and design professionals for their unique set of physical properties. For instance, the 20-2028 Polyurethane Foam was developed to offer reduced weight, low dielectric properties, durability, and strength. These properties come in handy in many electronic, aerospace, automotive, and marine applications. The 20-2028 Polyurethane is a closed cell foam with an easy […]
New Medical Grade Adhesive, Sealant, and Encapsulant
Epoxy adhesives, sealants and potting compounds must meet certain requirements in order to be considered for use within or as a part of a medical device. In addition to important cured properties such as hardness, temperature and chemical resistance, tensile strength and electrical insulation properties; the epoxy must also meet certain biocompatibility requirements. The ISO […]
Optical and Semiconductor Grade Epoxy Resin
An Optical and Semiconductor Grade Epoxy Resin system has been developed for LED encapsulating, glob top encapsulation, fiber optics and as an underfill for flip chips. The 20-3401 provides outstanding adhesion to glass, quartz, most plastics, and metals. It is easy to work with, allows users a long working time, and easily flows at room temperature. REACH and RoHS compliant, this epoxy […]
