News & Blog
Thermally Conductive Potting Compound-Formulated for large potting applications
A major challenge for engineers is finding cost-effective Thermally Conductive Potting Compounds for medium to large potting applications. Many of the commercially available high performance products are not viable options due to the cost that they add to the electronic devices. Also, most potting compounds create too much heat when curing in large mass sizes. […]
Low-Outgassing Epoxy Adhesives
Low outgassing Epoxy Adhesives and Epoxy Potting Compounds are sometimes required in aerospace, optical, and electro-optical applications. NASA has set the standard for testing when it comes to outgassing requirements. The two measurements that are used to screen materials are the Total Mass Loss (TML) and Collected Volatile Condensable Materials (CVCM) of the epoxy adhesive. The NASA […]
New Video: Silver Filled Electrically Conductive Epoxies
Watch our NEW VIDEO and learn more about silver-filled epoxy adhesives. Silver-filled epoxies are relied upon to securely join substrates and provide electrical and thermal conductivity in a variety of applications. Electrically conductive epoxy adhesives are ideal for use on heat-sensitive substrates, for field repair, or where soldering to a surface is not practical. By carefully […]
Fast Curing Toughened Epoxy Adhesive
Epoxy adhesives offer many advantages over traditional mechanical fasteners such as rivets, nuts and bolts, pins, or welding. However, conventional two part epoxies that offer excellent bonds can be slow curing. The new 10-3041 Toughened Epoxy Adhesive develops a 3,000 psi lap shear strength within four hours. Within minutes the material is dry to the touch. Epoxy adhesives […]
Heat Sink Fin Bonding Epoxy Adhesive
70-3812NC provides amazing structural strength when bonding aluminum fins to aluminum base plates. Many heat sink manufacturers are switching to this thermally conductive heat sink adhesive due to its 2,500 psi tensile lap shear strength (aluminum to aluminum). The 70-3812NC Aluminum Filled Epoxy is the go-to material for heat sink bonding. In addition to providing strong […]
STRESS FREE POTTING WITH LOW EXOTHERM EPOXY
Epoxy potting compounds are used to protect electronics from dust, moisture and chemicals. They can also insulate, conduct heat or provide protection from physical or thermal shock. Filling a large electronic assembly with an epoxy potting compound can be especially challenging due to the large mass. Selecting the wrong epoxy mixture can lead to a […]
