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20-3302 is a two component, ultra clear epoxy system. It provides excellent optical transmission along with outstanding adhesion and electrical properties. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy.

20-3060 is a filled system resulting in excellent dimensional stability and extremely low shrinkage. 20-3060 is characterized by exceptional resistance to impact, vibration, and thermal shock. In addition, this versatile resin system is machinable and ideal for use with meter mix dispensing equipment.

The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-0. 50-2369 FR Urethane is listed with Underwriter’s Laboratory for passing UL94 V-0. This system offers excellent heat transfer, low exotherm, and excellent electrical properties.

50-3112 is a two component fast curing thermally conductive epoxy adhesive. This product was specifically formulated for use in the convenient TriggerBond dual barrel cartridge system. 50-3112 has a simple 1:1 mix ratio and develops a 1,400 psi Lap Shear strength (aluminum to aluminum) in four hours at room temperature. After just twenty four hours the strength is over 2,200 psi.

50-3116 thermally conductive flexible epoxy formulation is designed for applications that require low stress during cure and electrical insulation.

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates.

50-3152 FR is listed with Underwriter's Laboratories for passing UL 94 V-0. It is a two component epoxy potting and encapsulating system. This semi-rigid epoxy has excellent shock and vibration resistance along with good thermal conductivity. 50-3152 FR is designed for ease of use. It has a convenient 1:1 mix ratio and is low in viscosity.

50-3185 NC is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 NC is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are available to choose from. When cured with Catalyst 190 or Catalyst 30 this system meets NASA’s outgassing requirements.

This high bond strength adhesive is a clear 100% solids, two component, low viscosity adhesive with a quick setting time of 5 minutes at room temperature. It is excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc...