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DC-2606
Heat Sink Fin Bonding Epoxy Adhesive
…the 70-3812NC passes NASA’s outgassing requirements per ASTM E-595-07. This is a two-component epoxy system formulated to be cured at room temperature or with mild heat. The 10:1 mix ratio…
Strong Bonding UV Adhesive Made Easy to Use
…use syringe packaging Excellent adhesion Excellent flow control Good water, chemical, and heat resistance No odor 100% solids Low shrinkage Smooth surface cure Samples may be requested by emailing Sales@epoxies.com….
Electrically Conductive Silver Filled Epoxy Adhesive
…better chemical resistance and adhesion than conductive inks. Other common applications for 40-3907 include solder replacement, EMI\RFI shielding, grounding, die attach, SMD attach, and flip chip attachments. Epoxies, Etc. has…
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Samples
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