Thermally Conductive Adhesives & Potting Compounds
Epoxies, Etc. is a leading manufacturer of thermally conductive epoxies, urethanes, and silicones. Our chemists and application engineers have developed polymer formulations that provide various cure schedules, viscosities, and fast continuous heat dissipation for a variety of electronic and industrial applications.
Our polymer systems include thermally conductive adhesives, potting compounds, and greases. These products utilize highly conductive fillers and also provide outstanding electrical insulation.
We have developed the below listed thermally conductive systems by formulating with unique combinations of fillers, particle sizes, and dispersion techniques. Flame retardant systems are also available. Not all products are listed, and custom formulations are available.
| Item # | Short Description | Vicosity cP | Thermal Conductivity, W/m·K | Operating Temperature Range, °C | |
|---|---|---|---|---|---|
50-1220 | One component thermally conductive silicone grease | Grease-like Paste | 1.15 | -40 to +210 |  |
50-1225 | Flexible silicone that offers high heat resistance | 32,000 | 1.73 | -65 to +210 | |
50-1952 | Thermally conductive silicone with easy to use 1:1 mix ratio | 30,000 | 1.10 | -65 to +235 | |
50-2151 | Low viscosity urethane potting compound | 10,000 | 1.15 | -55 to +130 | |
50-2366FR | Urethane offering low stress and flame retardancy | 4,000 | 1.15 | -65 to +135 | |
50-2369FR | UL 94 V-0 Listed Urethane | 8,500 | 1.15 | -65 to +135 | |
50-3100 | High Thermal K heat transfer epoxy resin | 6,000 to 180,000 | 2.16 | | |
50-3112 | Fast epoxy adhesive for use in the TriggerBond system | 70,000 | 1.04 | -40 to +120 | |
50-3116 | Low viscosity, flexible epoxy potting and encapsulating system | 10.200 | 1.01 | -70 to +150 | |
50-3122 | One component epoxy adhesive with wide temp. range | 165,000 | 1.44 | -60 to +205 | |
50-3141FR | Fast curing, flame retardant epoxy adhesive | Paste | 1.10 | -50 to +135 | |
50-3150FR | UL 94 V-0 Listed Epoxy With a Wide Variety of Viscosity Options | 1,500 to 85,000 | 2.16 | -60 to +200 | |
50-3151 NC FR | Low viscosity epoxy meets non-burning UL 94 V-0 | 5,000 | 1.30 | -65 to +190 | |
50-3152FR | UL 94 V-0 listed epoxy | 31,000 | 1.01 | -40 to +135 | |
50-3170 | Flexible epoxy potting and encapsulating system | 15,000 | 1.73 | -70 to +150 | |
50-3182 NC | Highly filled epoxy with excellent physical properties | 15,000 | 1.66 | -55 to +205 | |
50-3185 NC | Meets NASA outgassing with Cat.190 or Cat. 30 | 16,000 | 1.36 | -55 to +205 | |
50-3186 NC | Thermally conductive epoxy adhesive | Paste | 1.38 | -40 to +230 | |
50-3253FR | 1:1 mix ratio system meets UL 94 V-0 requirements | 60,000 | 2.16 | -65 to +155 | |
70-3812 NC | Aluminum filled adhesive for bonding heat sinks | 8,000 | 4.5 | -55 to +155 | |
Having trouble deciding on which of our products best meets your critical heat transfer requirements? Then let us assist you in selecting a product by using our online Product Selection Form. If we do not have an existing product that meets your requirements, we will develop one!
IMPORTANT:
EPOXIES, ETC. MAKES NO EXPRESS OR IMPLIED WARRANTIES OR MERCHANTABILITY, FITNESS OR OTHERWISE WITH RESPECT TO ITS PRODUCTS. The information in this brochure is based on data obtained by our own research and is considered reliable. However, no warranty is expressed or implied regarding the accuracy of these data, the results to be obtained from the use thereof, or that any such use will not infringe any patent. The properties given are typical values and are not intended for use in preparing specifications. This information is furnished upon the condition that the person receiving it shall make his own tests to determine the suitability thereof for his particular purpose.
