Encapsulating and Potting Compounds
Listed below are several of our specialty formulated electronic insulating compounds. Epoxies, Etc.’s resins are used to protect, insulate, and conceal circuitry, components, and devices. These potting, casting and encapsulating compounds were formulated to satisfy the requirements of many demanding applications in the electronic, electrical, automotive, and aerospace industries.
These compounds have a variety of durometers and cure schedules to choose from. Not all products are listed, and custom formulations are available upon consultation.
| Item # | Short Description | Vicosity cP | Specific Gravity | Hardness | Operating Temperature Range, °C | |
|---|---|---|---|---|---|---|
20-1615 | Water clear silicone with a low viscosity | 6,000 | 1.03 | 40A | -65 to + 205 |  |
20-1625 | Optically clear 1:1 silicone potting system | 4,500 | 0.98 | 25A | -55 to +200 | |
20-1634 | Low density (light weight) silicone elastomer | 30,000 | 0.82 | 34A | -65 to +235 | |
20-1640 | Flexible silicone that does not stress components | 50,000 | 1.54 | 34A | -65 to +235 | |
20-1650 | High Temperature Silicone Potting Compound | 7,100 | 1.04 | 30A | -65 to +300 | |
20-1700 | Soft, fast curing, clear silicone gel | 6,500 | 0.98 | Soft Gel | -55 to +200 | |
20-1705 | Firm, fast curing clear silicone gel | 6,500 | 0.98 | Firm Gel | -55 to +200 | |
20-2028 | Low density (light weight) closed cell urethane | 250 | 1.23 | Foam | -50 to +150 | |
20-2101 | Polyurethane Gel | 1,600 | .97 | Gel | -55 to +125 | |
20-2121 | Unfilled low durometer urethane | 3,200 | 1.10 | 65A | -30 to +125 | |
20-2160 | Medium Durometer Polyurethane Potting Compound | 1,500 | 1.03 | 60A | -55 to +125 | |
20-2180 | Medium Durometer Polyurethane Potting Compound | 2,000 | .97 | 80A | -55 to +125 | |
20-2183 | Polyurethane Potting and Encapsulating Compound | 2,200 | .97 | 80A | -55 to +125 | |
20-2330 | Excellent hydrolytic stability with a low Tg (Shore A 30) | 3,000 | 1.13 | 30A | -72 to +125 | |
20-2345 | Excellent hydrolytic stability with a low Tg (Shore A 45) | 5,000 | 1.17 | 45A | -72 to +125 | |
20-2366FR | For potting applications containing surface mount components or any application requiring low stress, thermal conductivity and flame retardancy | 4,000 | 1.56 | 65D | -65 to +135 | |
20-2370 | Excellent hydrolytic stability with a low Tg (Shore A 70) | 4,300 | 1.2 | 70A | -72 to +125 | |
20-2390 | Excellent hydrolytic stability with a low Tg (Shore A 90) | 3,200 | 1.2 | 90A | -72 to +125 | |
20-2521 | High performance urethane | 5,500 | 1.60 | 65D | -55 to +130 | |
20-2523 | Excellent thermal shock and vibration resistant urethane | 2,950 | 1.44 | 50D | -55 to +130 | |
20-2620 | A two-component Polyurethane compound designed for applications requiring “water like” clarity. | 2,700 | 1.1 | 85A/40D | -40 to +135 | |
20-2621 | Water clear urethane with UV resistance | 2,700 | 1.10 | 85A | -40 to +135 | |
20-3001 | A low viscosity, unfilled system which forms a bubble free glass like finish when cured. | 1000 | +4 to +130 | | ||
20-3001NC | Easy to use unfilled epoxy with a low viscosity | 1,000 | 1.12 | 65D | -50 to +150 | |
20-3004HV | Excellent chemical resistance with a high viscosity | Gel | 1.06 | 78D | -50 to +150 | |
20-3004LV | Excellent chemical resistance with a low viscosity | 7,000 | 1.17 | 78D | -50 to +140 | |
20-3006 | Flexible epoxy potting compound with easy 1:1 mix ratio | 19,000 | 1.45 | 75A/30D | -50 to +140 | |
20-3030 | An unfilled, low viscosity epoxy system designed for fast, self-leveling applications with a convenient 2:1 mix ratio.; excellent adhesion to metals, plastic, and coated lead wires. | 10,000 | 1.09 | 85D | -40 to +135 | |
20-3035 | Low density (light weight) epoxy syntactic foam | 25,000 | 0.82 | 80D | -40 to +130 | |
20-3060 | Excellent impact and vibration resistant epoxy | 10,000 | 1.50 | 82D | -50 to +135 | |
20-3064NC | Variable hardness epoxy system provides good adhesion | 13,500 | 1.40 | 60A-80D | -40 to +100 | |
20-3068 | FDA compliant epoxy potting compound | 10,600 | 1.00 | 88D | -40 to +135 | |
20-3072 | Excellent chemical, corrosion resistance and electrical insulation | 37000 | | |||
20-3213 | One component insulating epoxy | 3,000 | 1.13 | 85D | -40 to +135 | |
20-3236 | Bonds to difficult substrates such as vinyls and neoprenes | 3,000 | 1.07 | 80D | -55 to +120 | |
20-3300 | High temperature resistant epoxy with easy 1:1 ratio | 12,000 | 1.65 | 87D | -70 to +260 | |
20-3301 | Wide service temperature range, thermal shock resistant | 5,800 | 1.03 | 60D | -55 to +155 | |
20-3302NCLV | Low viscosity version of the 20-3302 | 250 | 1.10 | 85D | -45 to +135 | |
20-3305 | Two part epoxy system ideal for thermal shock exposure | 5000 | -55 to +155 | | ||
20-3401CL | Medical, Optical and Semiconductor Grade Epoxy System | 350 | 1.10 | 82D | -45 to +150 | |
Having trouble deciding on which of our products best meets your critical potting and encapsulating requirements? Then let us assist you in selecting a product by using our online Product Selection Form. If we do not have an existing product that meets your requirements, we will develop one!
IMPORTANT:
EPOXIES, ETC. MAKES NO EXPRESS OR IMPLIED WARRANTIES OR MERCHANTABILITY, FITNESS OR OTHERWISE WITH RESPECT TO ITS PRODUCTS. The information in this brochure is based on data obtained by our own research and is considered reliable. However, no warranty is expressed or implied regarding the accuracy of these data, the results to be obtained from the use thereof, or that any such use will not infringe any patent. The properties given are typical values and are not intended for use in preparing specifications. This information is furnished upon the condition that the person receiving it shall make his own tests to determine the suitability thereof for his particular purpose.
