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70-3812 NC is a two component, aluminum filled epoxy system. This system is used for making heat resistant tools, parts, or bonds that require the highest thermal conductivity and heat resistance. 70-3812 NC passes NASA’s outgassing requirements per ASTM E-595-07.

UV Cure 60-7114 is a low viscosity urethane adhesive, potting compound and coating. This UV Curable Resin is formulated to provide excellent water and chemical resistance. It is a good choice for potting electronic assemblies exposed to excessive moisture. UV Cure 7114 has very good adhesion to metal and plastic substrates.

20-3035 is a low density, two component epoxy potting and encapsulating system. This epoxy syntactic foam system utilizes an advanced micro balloon technology filler. The 20-3035 provides high strength and stiffness, thermal and environmental stability, creep resistance, and water resistance.

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates.

20-2523 is a high performance two component flexible urethane system. This easy to use polyurethane is very low in viscosity and ideal for potting or encapsulating delicate electronic components.

40-3900 is a two component epoxy adhesive filled with silver. This electrically conductiv eepoxy resin formulation offers continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm-cm. 40-3900 is also well known for its wide operating temperature range, -50 to + 170°C. 40-3900 is specifically designed for adhesive bonding in microelectronic and optoelectronicapplications. Due to its excellent continuity, it has also been used extensively in applications such as micro-wave EMI and RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connectors, circuitry, and as a cold solder. 40-3900 is formulated with pure silver (no alloys) and is designed in a convenient 1:1 mix ratio. Both the resin and hardener have silver powder dispersed.

20-2028 is a light weight, two component, closed cell, liquid urethane foaming resin system designed for potting and encapsulating. The density is 11 pounds per cubic foot. 20 2028 has been formulated for ease in handling with a convenient 1:1 mix ratio, low viscosity, and short demolding time. Castings can be hand poured or machine dispensed.

UV Cure 60-7170 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7170 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. UV Cure 60-7170 is a good choice for potting and encapsulating applications due to its ability to deep section cure up to ¾ inch. Another unique and important feature is its ability to “dark cure.” Once exposed to UV light the UV Cure 60-7170 will continue to cure in the absence of light.

70-3814 is a two component fast curing aluminum filled thermally conductive epoxy adhesive. This product was specifically formulated for use in the convenient TriggerBond? dual barrel cartridge system.

This electrically conductive epoxy resin formulation offers the maximum in continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm-cm.