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This two component urethane series are low durometer (30-90 Shore A), potting, casting, and encapsulating compounds. They are unfilled materials engineered to provide excellent hydrolytic stability and low moisture permeability. They have outstanding thermal cycling properties, low glass transition temperatures and low embedment stress to sensitive electronic components.

20-2521 is a high performance two component urethane system. This easy to use polyurethane is very low in viscosity and ideal for potting and encapsulating delicate electronic components.

50-3253FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL 94 V-0. This medium viscosity system offers an easy to use 1:1 mix ratio system that has high thermal conductivity, low shrinkage, low exotherm, and outstanding electrical insulation properties. The high thermal conductivity helps extend the life of assemblies by quickly dissipating heat away from critical components.

20-2621 is a two component Polyurethane compound designed for applications requiring “water like” clarity. This room temperature curing system provides excellent environmental protection and will not yellow over time.

20-3236 Resin is a low viscosity copolymer adhesive and potting compound specifically designed for bonding vinyls and neoprenes. 20-3236 Resin can be used in many difficult bonding applications. It is also used for the encapsulation of vinyl insulated electrical components or sealing vinyl lead wires.

50-1225 is a low viscosity, room temperature curing silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package. 50-1225 can be used for potting or encapsulating electronic packages that have sensitive components.

10-3063 is a room temperature curing, two component, epoxy potting compound and adhesive.The 10-3063 provides good water resistance, adhesion, and toughness. It is packaged in the convenient TriggerBond dual barrel cartridge system. The 10-3063 Epoxy System meets the Food and Drug Administration (FDA) regulations permitting use in “indirect” food contact applications. The raw materials used in the products comply with the FDA regulations of Title 21 Code of Federal Regulations under Sections 175.105 and 175.300.

20-3072 is a room temperature curing, two component, epoxy potting compound and adhesive. Both the 20-3072 and 20-3072LV (low viscosity version of 20-3072) provide good water resistance, adhesion, and toughness. The 20-3072 and 20-3072LV Epoxy Systems meet the Food and Drug Administration (FDA)regulations permitting use in “indirect” food contact applications. The raw materials used inthe products comply with the FDA regulations of Title 21 Code of Federal Regulations under Sections 175.105 and 175.300.

20-1615 is a two component, room temperature curing silicone rubber compound. This silicone system is clear, odorless, and low in viscosity. 20-1615 is an excellent choice for potting electronic assemblies that require shock and vibration resistance.

This two component urethane series are low durometer (30-90 Shore A), potting, casting, and encapsulating compounds. They are unfilled materials engineered to provide excellent hydrolytic stability and low moisture permeability. They have outstanding thermal cycling properties, low glass transition temperatures and low embedment stress to sensitive electronic components.