If Your Electronic Components Are Melting Under Pressure – Epoxies, Etc. Can Help

Electronics can produce a lot of heat. Epoxies, Etc. offers a solution with several thermally conductive potting compounds that protect your electronic components from the damages of overheating, stress and shock. They transfer heat well, have low shrinkage and exotherm, and excellent electrical insulation properties.

Each product was designed with unique characteristics to make it a good fit for a certain type of application.

50-1952
Flexible Silicone Potting Compound (1:1 mix ratio) with outstanding heat transfer and electrical properties from -65 to +235°C. It is solvent free and therefore will not release by-products on cure making it safer to handle than many of its counterparts and non-regulated for transport.

50-2369FR
UL listed Flame Retardant Polyurethane Potting Compound with excellent heat transfer and water resistance. This product is great for outdoor use.

50-3150FR
UL listed Flame Retardant Epoxy Potting Compound which transfers heat very quickly, has outstanding moisture and chemical resistance, and is free of bromine, halogen, and antimony. It is also compliant with REACH and RoHS standards. Ideal for encapsulating power supplies, transformers, coils, sensors, and more.

50-3152FR
Flame Retardant Epoxy Resin (1:1) designed for ease of use. It is semi-rigid offering excellent shock and vibration resistance and great thermal transfer.

50-3185NC
Filled Epoxy Potting and Encapsulating Compound with very low thermal expansion, outstanding electrical insulation, and high thermal conductivity. This material is ideal for high voltage applications. It meets NASA’s outgassing requirements.

Samples are available by contacting Sales@epoxies.com.