Epoxies, Etc.’s new 10-3080 epoxy offers customers an ultra-clear adhesive and coating compound. The 10-3080 is formulated with proprietary materials which help prevent premature yellowing and degradation. The 10-3080 exhibits…
A new fast curing Aluminum Filled Epoxy Adhesive (70-3814) was developed by Epoxies, Etc. This thermally conductive adhesive has 1,000 psi of strength in just four hours! After twenty-four hours…
20-3006 is a unique two component, electronic grade, flexible epoxy potting compound. This system was engineered to provide electrical insulation, chemical protection, and thermal shock resistance. The flexibility of 20-3006 provides low stress on surface mount and other delicate electronic components. This encapsulating and potting compound has an easy one to one mix ratio, and is D.O.T. non-hazardous.
20-2620 is a two component Polyurethane compound designed for applications requiring “water like” clarity. This room temperature curing system provides excellent environmental protection and will not yellow over time.
20-2620 is semi-flexible and will not place excess stress on electronic components. It also has a low viscosity, which facilitates easy flow and penetration into difficult areas.
…Shipment, please help us by completing the International Shipment Form. This information will also allow us to comply with all international shipping requirements. “*” indicates required fields Billing Address Company*…
…engineers choose the best packaging for the application. Hinge Packs, TriggerBond, FreezeBond, and common bulk packaging are explained in this video. For more Tips and Tricks and Knowledge That Sticks…
20-3302 is a two component, ultra clear epoxy system. It provides excellent optical transmission along with outstanding adhesion and electrical properties. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy.
20-3035 is a low density, two component epoxy potting and encapsulating system. This epoxy syntactic foam system utilizes an advanced micro balloon technology filler. The 20-3035 provides high strength and stiffness, thermal and environmental stability, creep resistance, and water resistance.
50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure. 50-3170 can be used for bonding sensitive components or for potting of power supplies, coils, glass diodes, and other delicate assemblies.
This is a solvent free epoxy system filled with pure silver. It has outstanding adhesion to aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic, and printed circuit boards.
