Thermally Conductive Resins

Epoxies, Etc.. is a leader in thermal management materials. Our chemists and application engineers have developed formulations that provide fast heat dissipation for a variety of electronic and industrial applications.

Our thermally conductive polymer systems include adhesives, potting compounds, and greases. These products utilize highly conductive fillers and also provide outstanding electrical insulation. We have developed these conductive systems by formulating with unique combinations of fillers, particle sizes, and dispersion techniques.

Key Benefits

• Fastest and most continuous heat transfer systems
• Variety of cure schedules and viscosities available
• Flame retardant systems available

Go to Conversions, Measures, and Weights

PRODUCT DESCRIPTION MIXED VISCOSITY CPS THERMAL CONDUCTIVITY BTU·IN/FT2·HR·°F TENSILE STRENGTH PSI OPERATING TEMP. °C 50-1220 One component thermal grease. This heavy filled Heat Sink Compound promotes high thermal conductivity, low bleed, and high temperature stability. Grease Like Paste 8 - -40 to +210 50-1225 Low viscosity, room temperature curing, RTV silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package. 32,000 12 850 -65 to +210 50-2366FR This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. 9,000 8 2,200 -65 to +135 50-2369FR 50-2369 FR Urethane is listed with Underwriter’s Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical properties. This system is a good choice for potting applications containing surface mount components or any application requiring low stress, thermal conductivity and flame retardancy. 50-2369 FR is suitable for outdoor use. 8,500 8 3,500 -65 to +135 50-3100 High thermal transfer epoxy resin. Has outstanding thermal shock and high temperature resistance. Flame retardant version available; 50-3100 FR. 180,000 15 8,800 -60 to +200 50-3120 Highly filled one component paste epoxy. Good thermal shock, electrical insulation and chemical resistance. Will not "run" once applied. Paste 8 7,500 -60 to +165 50-3122 One component epoxy adhesive with a unique combination of properties.  This adhesive provides both high shear and high peel strengths.  It also offers superior resistance to impact, thermal shock, vibration & stress fatigue cracking. 165,000 10 9,500 -60 to +205 50-3150FR UL Approved This system offers excellent heat transfer, low shrinkage, and outstanding insulation properties. Typical applications for 50-3150 FR include encapsulating power supplies, transformers, coils, insulators, sensors, etc... This system is an excellent choice for applications requiring high thermal conductivity and flame retardancy. 30,000 15 9,850 -60 to +200 50-3151FR Low viscosity flame retardant epoxy resin. Meets non-burning requirements of UL94 V-O. Its low viscosity allows outstanding flow around components. 5,000 9 9,850 -65 to +190 50-3170 Highly filled thermally conductive epoxy rubber. Ideal for potting electronic packages with low stress requirements. 50-3170 is a repairable system. 15,000 12 2,500 -70 to +150 50-3182 Highly filled thermally conductive epoxy potting compound.  It provides very high thermal conductivity, excellent electrical insulation, and low thermal expansion. 15,000 11.5 8,500  -55 to +205 50-3185 Highly filled potting and encapsulating epoxy resin. Excellent electrical insulator and mechanical protector. Designed for the most demanding high voltage applications. Meets NASA's outgassing requirements. 16,000 9.4 8,500 -55 to +205 50-3186 Two part thermally conductive epoxy adhesive is a perfect choice for applications requiring high thermal conductivity, low thermal expansion, and high operating temperature performance. Paste 9.6 2,700 -40 to +230

IMPORTANT: The information in this table is based on data obtained by our own research and is considered accurate. However, no warranty is expressed or implied regarding the accuracy of these data, the results to be obtained from the use thereof, or that any such use will not infringe any patent. This information is furnished upon the condition that the person receiving it shall make his own tests to determine the suitability thereof for his particular purpose.

Having trouble deciding on which of our products best meets your critical heat transfer requirements? Then let us assist you in selecting a product by using our online Product Selection Form. If we do not have an existing product that meets your requirements, we will develop one!